Simon Jude Burgos

Simon Jude Burgos is a semiconductor engineering professional with over 15 years of experience in customer engineering, new product introduction (NPI), product development, advanced packaging, and high-volume manufacturing.

Currently serving as a 𝑺𝙩𝒂𝙛𝒇 𝑪𝙪𝒔𝙩𝒐𝙢𝒆𝙧 𝙀𝒏𝙜𝒊𝙣𝒆𝙚𝒓 𝒂𝙩 𝙐𝒏𝙞𝒕𝙚𝒅 𝑻𝙚𝒔𝙩 𝙖𝒏𝙙 𝘼𝒔𝙨𝒆𝙢𝒃𝙡𝒚 𝑪𝙤𝒓𝙥𝒐𝙧𝒂𝙩𝒊𝙤𝒏 (𝙐𝑻𝘼𝑪) 𝙞𝒏 𝑺𝙞𝒏𝙜𝒂𝙥𝒐𝙧𝒆, a global leader in outsourced semiconductor assembly and test (OSAT) services which delivers advanced semiconductor packaging and testing solutions from strategic locations in Singapore, Thailand, Indonesia, and China. He leads customer engagements and cross-functional teams in delivering turnkey semiconductor assembly and test solutions from concept to production.

Throughout his career, Simon has successfully managed complex semiconductor programs involving Wafer Level Chip Scale Packaging (WLCSP) and Fan-Out Wafer Level Chip Scale Packaging (FOWLCSP), driving products through the complete lifecycle from development, qualification, characterization, and process optimization to manufacturing release. He played a key role in the successful mass production ramp of M-Series FOWLCSP products at Nepes Hayyim Corporation (formerly Decatechnologies), contributing to the advancement of next-generation semiconductor packaging technologies.

During his tenure with Knowles Electronics Philippines, Simon served as Lead Product Engineer in the pioneering team responsible for transferring the Electronics Business Unit from manufacturing facilities in China and Austria to the Philippines. He successfully managed new product releases, cross-site technology transfers from China and Austria, product qualification programs, and design reviews while coordinating with engineering, manufacturing, and commercial teams across multiple global locations. He also served as an Acoustics Instructor in Knowles' first industry-academic collaboration program with University of San Jose-Recoletos.

Earlier in his career at Littelfuse Philippines, Simon led fuse product development projects encompassing product design, process development, reliability engineering, and failure analyses. His technical contributions led to the co-invention of a patented fuse technology, resulting in U.S. Patent No. 9,202,656, "Fuse with Cavity Block“.

Simon holds both a Master of Science in Physics and a Bachelor of Science in Physics (Magna Cum Laude) from Mindanao State University - Iligan Institute of Technology. His expertise spans semiconductor packaging, customer engineering, APQP, product qualification, DOE, failure analysis, quality assurance, project management, and advanced manufacturing processes. He combines deep technical knowledge with strong leadership and customer engagement skills to drive innovation, operational excellence, and successful product commercialization in the semiconductor industry.

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